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PREMIUM
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VAPOR-PHASE
SOLDERING SYSTEMS

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Vapor phase soldering? 
BSC SOLDER SYSTEMS!

Good soldering is no high-wire act.

With our JUST SOLDER vapor phase soldering systems, we develop and manufacture professional solutions for reliable SMD soldering in Dortmund, Germany – for prototypes, small and medium series, as well as special soldering tasks. Our systems combine user-friendliness with maximum process reliability and are specifically designed for electronics developers, laboratories, prototype production areas, and educational institutions such as technical universities.

Benchtop soldering systems with vapor phase technology

Instead of hot air, our systems work with controlled vapor. This allows us to achieve uniform solder joints with no thermal shadowing, protect components from overheating, and ensure reliable results – even on very complex assemblies.

Reflow-condensation soldering (also called vapor phase) is a highly efficient and gentle soldering process. We solder standard lead-free applications at only 230 °C! This also makes our vapor phase systems ideal for desoldering and rework!

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Want to learn more about vapor phase soldering? Just scroll down. We’ve described vapor phase soldering in more detail in the next section.​

Vapor phase soldering

Vapor phase soldering is a special form of SMD reflow soldering in which the solder joints are formed in a controlled vapor phase. Unlike convection reflow ovens that use hot air, soldering is carried out in hot vapor. A special fluid is used to generate the vapor. Both the liquid and the vapor are electrically non-conductive. These fluids are available with different boiling points so that, depending on the application, the soldering temperature can be defined via the medium. For lead-free soldering, GALDEN© LS-230 is generally used, so soldering is carried out at a maximum of 230 °C. As the liquid has approximately twice the density of water, the vapor displaces the oxygen and soldering can take place in an oxygen-free atmosphere. No residues of the fluid remain on the soldered boards. The fluids are chemically inert and therefore do not react, for example, with fluxes.

Here we have summarised the advantages of condensation soldering:

  • Uniform and reliable solder joints: Using vapor as the heat transfer medium ensures a uniform temperature distribution without thermal shadowing, resulting in high-quality and reliable solder joints. This minimizes the risk of cold solder joints or insufficient connections.

  • High reproducibility: As the soldering process takes place in a controlled environment, vapor phase soldering offers very high reproducibility.

  • Protection against oxidation: The vapor phase acts as a protective layer and prevents the formation of oxide layers on the components to be soldered. This improves the wettability of the component surfaces and the quality of the solder joints.

  • Suitable for complex assemblies: Vapor phase soldering enables effective heat transfer to complex assemblies with many components and different package sizes and shapes, allowing even difficult solder joints to be reached.

  • Gentle soldering: For lead-free soldering, PFPE fluid with a boiling point of 230 °C is used. As a result, even at peak temperature only 230 °C is reached – components and the PCB are therefore soldered very gently.

  • Safe soldering: Because comparatively low temperatures are required and the maximum temperature is limited by the boiling point of the GALDEN© fluid, overheating cannot occur if the process is used correctly.

  • Energy-efficient: Compared with other soldering processes, vapor phase soldering is energy-saving thanks to its lower temperatures and efficient heat transfer.

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