A "float" occurs when the soldered component is not properly connected to the printed circuit board and does not lie flat. This can happen, for example, if an insufficient amount of solder or flux is used during the soldering process to ensure proper wetting and connection.

​

A float can result in an electrically or mechanically unstable connection between the component and the circuit board. This may lead to unreliable electrical connections or even component failure.

​

To prevent floats, it is crucial to use the correct amount of solder and flux during the soldering process to ensure good wetting and connection. It is also important to use the appropriate soldering temperature and time to achieve proper soldering. Visual inspection of the solder joint after soldering can also help identify and correct floats or other soldering defects. However, floats are not always easily detectable. Viewing the solder joint at an angle can be advantageous, as it is often impossible to identify a float when viewed directly from above.