Desoldering Device for Removing SMD Components from Circuit Boards
A desoldering device specifically designed for safely removing SMD components from printed circuit boards. Ideal for BGA and various other component types. Perfect for use in vapor-phase soldering systems. The component to be desoldered is attached to the tool using adhesive tape (included). Both the circuit board and the SMD desoldering device are placed together in a soldering system and heated simultaneously. When the solder melts, the device cleanly lifts the component from the solder joints. Usually, no further rework is required on either the circuit board or the component. Apply flux to the component's contacts before desoldering.
Perfect for sustainable repairs of electronic assemblies and for rescuing and reusing SMD components.