FELDER SMD Solder Paste ISO-Cream "Active-Clear" – Reliable Solution for SMD Soldering Processes
FELDER SMD Solder Paste ISO-Cream "Active-Clear" has been specifically developed for precise and clean soldering tasks in surface-mount technology (SMD). With its optimized formulation, it ensures reliable bonding of electronic components and promotes uniform wetting of solder joints. It is suitable for use both in prototype production and series manufacturing.
Properties:
  
Low flux spread
  
Excellent wetting on all common surfaces
  
Minimal flux residues, extending cleaning intervals for reflow ovens
  
True no-clean quality
  
Excellent print quality  long stencil life of at least 72 hours
  
Consistent soldering results across various soldering profiles
  
Resistant to environmental influences
  
Stable viscosity, even during printing pauses
Technical Details:
  
Alloy: Sn96.5/Ag3.0/Cu0.5
  
Melting point: approx. 217 °C
  
Grain size: Type 5 (15–25 µm) – optimal for ultra-fine pitch applications
Applications: This solder paste is versatile and suitable for manual application as well as automated soldering processes. Its stable composition ensures reliable results, even during extended production cycles.
Quality by FELDER: For decades, FELDER has provided innovative solutions in soldering technology. The ISO-Cream "Active-Clear" combines high standards with a practical formulation tailored to meet the demands of modern electronics manufacturing.

Image shows grain size 4 and serves as an example illustration.